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TCA62724FMG(o,s,el 2010-06-24 1 toshiba cmos integrated ci rcuit s silicon monolithic TCA62724FMG(o,s,el 3-channel constant-cu rrent led driver the TCA62724FMG is an optimal constant -current led driver for rgb pixel leds. the device supports 16 dimming states for each color in the rgb pixel led setup, resulting in 4096 colors for carrying out illumination by internal pwm. the max forward current of the led is set up using the external resistor. this ic is especially for driving back light white leds in lcd of pda, cellular phone, or handy terminal equipment. features ? power supply voltage range : 2.8 to 5.5 v ? constant current range : 5 to 150 ma ? low consumption current supply current at operation (iout = 20 ma / dc) : 700 a (max) supply current at standby : 10 a (max) ? for anode common led ? i 2 c interface ? package : son10-p-0303-0.50 weight: 0.018 g (typ.)
TCA62724FMG(o,s,el 2010-06-24 2 pin assignment (top view) terminal description pin no. pin name function 1 shdn the shutdown signal input terminal. in the case of "l" level input, the ic becomes the power-saving mode. in the case of "h" level input, the ic becomes the operation mode. 2 sda serial data input / output terminal. 3 scl serial clock input terminal. 4 reset the data reset signal input terminal. in the case of "l" leve l input, data is reset. in the case of "h" level input, the ic becomes the operation mode. 5 gnd grand terminal. 6 rext the output current setting resistor connection terminal. resistance is connected with this terminal between gnd. the output current does not flow when this terminal is opened. excessive output current will destroy the ic if this terminal is connected to gnd. 7 out2 8 out1 9 out0 constant current output terminal. 10 vin supply voltage input terminal. vin out0 out1 out2 rext 1 2 3 4 5 10 9 8 7 6 vin out0 out1 out2 rext sda scl reset gnd 1 2 3 4 5 10 9 8 7 6 ass?ly in first half of year (the 26th week from the first week) ass?ly in latter half of year (the 53rd week from the 27th week) shdn sda scl reset gnd shdn
TCA62724FMG(o,s,el 2010-06-24 3 block diagram example applications : cellular phone application as camera light (primary-color red, green and blue leds combine to em it good-quality white light for color reproducibility.) scl sda rext out2 out1 out0 pwm logic i 2 c interface logic vin constant current circuit shdn reset gnd 1 2 3 4 5 6 7 8 9 10 scl bus line 2.8 to 5.5 v sda bus line shdn sda scl reset gnd vin out 0 out 1 out 2 rext TCA62724FMG sda scl microcontroller v out v in 150 ma v in rext = 3.7 k ? red green blue 150 ma 150 ma camera light *i sda will recommend 3 ma. i sda
TCA62724FMG(o,s,el 2010-06-24 4 i/o equivalent pin circuits 1. shdn terminal 2. sda terminal 3. scl terminal 4. reset terminal 5. vin,gnd terminal 10 vin 5 gnd 1 v in shdn v in 2 v in sd a v in 3 v in scl v in 4 v in reset v in
TCA62724FMG(o,s,el 2010-06-24 5 i 2 c interface *data transfer format s slave address 7 bits r/w a sub-address 8 bits a data byte 8 bits a p *start condition (s), stop condition (p) start condition : a high to low transition on the sda line while scl is high. stop condition : a low to high transition on the sda line while scl is high. *data validity please do not change sda, when scl is "h". sda can be changed, when scl is "l". *acknowledge (a) whenever it receives the 1-byte data from a transmitter, a receiv er has to generate acknowledge .the receiver is obliged to gen erate an acknowledge after each byte has been received. s p start condition stop condition scl sda sda can't be changed. sda change is possible. scl sda s 1 8 9 clock for acknowledge acknowledge sda from transmitter sda from receiver scl from master sda can't be changed. sda change is possible. sda change is possible.
TCA62724FMG(o,s,el 2010-06-24 6 *slave address TCA62724FMG bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0 1 0 1 0 1 0 1 r/w r/w: when this bit is set to ?h?, read mode app lies; when it is set to ?l?, write mode applies. *sub-address pwm0 (pwm duty data setup of out0) bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0 ai 0 0 0 0 0 0 1 pwm1 (pwm duty data setup of out1) bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0 ai 0 0 0 0 0 1 0 pwm2 (pwm duty data setup of out2) bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0 ai 0 0 0 0 0 1 1 enable / shdn (data setup of enable / shdn) bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0 ai 0 0 0 0 1 0 0 ai: when this bit is set to ?h?, auto-increment is of f; when it is set to ?l ?, auto-increment is on. *data byte pwm0, pwm1, and pwm2 data pwm on duty data (0/15 to 15/15) bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0 don?t use pwm on duty data (default =?0000?) bit 3 bit 2 bit 1 bit 0 data pwm on duty 1 1 1 1 15/15 1 1 1 0 14/15 1 1 0 1 13/15 1 1 0 0 12/15 1 0 1 1 11/15 1 0 1 0 10/15 1 0 0 1 9/15 1 0 0 0 8/15 0 1 1 1 7/15 0 1 1 0 6/15 0 1 0 1 5/15 0 1 0 0 4/15 0 0 1 1 3/15 0 0 1 0 2/15 0 0 0 1 1/15 0 0 0 0 0/15 enable / shdn data bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0 don?t use x x enable shdn (default = ?00000000?) enable data h : output blinks at pwm0, pwm1, and pwm2 rate l : output is off shdn data h : output blinks at pwm0, pwm1, and pwm2 rate l : power-saving mode
TCA62724FMG(o,s,el 2010-06-24 7 *write mode auto-increment off auto-increment on s slave address r/w (0) a sub- address a data a data a - - - p the data of the immediately following sub-address can be written in. *read mode s slave address r/w (1) a first byte a second byte p first byte (enable / shdn data and pwm2 data) bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0 x x enable shdn pwm2 data second byte (pwm1 data and pwm0 data) bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0 pwm1 data pwm0 data s slave address r/w (0) a sub- address adata a sub- address a data - - - p
TCA62724FMG(o,s,el 2010-06-24 8 setting of output current (reference data) the output current is set by the resistance connected between terminal r ext and gnd. the output current can be set according to the following expression. output voltage ? output current (reference data) note1: these application examples are prov ided for reference only. thorough evaluation and testing should be implemented when designing your application's mass production design. v ds vs. i out 0 20 40 60 80 100 120 140 160 180 0.0 0.5 1.0 1.5 2.0 2.5 3.0 v ds (v) i out (ma) i out vs. r ext 0 25 50 75 100 125 150 020406080100 r ext ( ? ) i out (ma) r ext = 3.6 k ? r ext = 11 k ? r ext = 110 k ? i out (ma) = 1.17 (v) r ext (k ? ) 460 t a =25c v ds =1.0 v
TCA62724FMG(o,s,el 2010-06-24 9 absolute maximum ratings (t a = 25c) characteristic symbol ratings *1 unit supply voltage v in ? 0.3 ~ + 6.0 v output voltage v out ? 0.3 ~ + 6.0 v input voltage (sda/scl/ shdn / reset te r m i n a l ) v in ? 0.3 ~ v in + 0.3 *2 v 0.36 (free air) power dissipation p d 0.79(on pcb) *3,4 w 340 (free air) thermal resistance r th (j-a) 158 (on pcb) *3 c/w operating temperature t opr ? 40 ~ + 85 c storage temperature t stg ? 55 ~ + 150 c maximum junction temperature t j 150 c note1: voltage is ground referenced. note2: do not exceed 6.0v. note3: pcb condition 40 mm x 40 mm x 1.6 mm, cu = 10 % note4: the power dissipation decreases the reciprocal of t he saturated thermal resistance (1/ rth(j-a)) for each degree (1c) that the ambient temperature is exceeded (ta = 25c). recommended operating condition characteristic symbol condition min typ. max unit supply voltage v in - 2.8 3.6 5.5 v constant current output i out out0 to out2 5 - 150 ma/ch rext resistance r ext - 3.7 - 109 k electrical characteristics (unless otherwise specified, t a = 25 c , v in = 3.6v) characteristic symbol condition min typ max unit supply voltage v in - 2.8 3.6 5.5 v supply current (ic operation) i in (on) r ext = 27.6 k , v in = 3.6 v - - 700 a supply current (ic standby) i in (off) shdn = l - - 10 a high level v ih 0.7v in - v in +0.15v input voltage low level v il measuring terminal is sda, scl, shdn , reset ? 0.15 - 0.3v in v high level i ih ? 1.0 - 1.0 input current low level i il measuring terminal is scl, shdn , reset ? 1.0 - 1.0 a gain (i out /i rext ) gain r ext =11k 359 460 560 a/a rext terminal voltage v rext v in =3.6v, r ext =11k 1.09 1.17 1.25 v output leakage current i oz shdn =?l?, v out =5.5v - - 0.1 a constant current accuracy between bits di out v in = 3.6 v, r ext = 11 k - 1 7.5 % pwm frequency f pwm - - 3.0 - khz time from shdn release to start of operation t re - - - 5 ms
TCA62724FMG(o,s,el 2010-06-24 10 characteristics of the sda and scl bus lines for i 2 c-bus devices standard mode characteristic symbol min max unit scl clock frequency f scl 0 100 khz bus free time between stop and start condition t buf 4.7 - s hold time (repeated) start condition t hd;sta 4.0 - s setup time for repeated start condition t su;sta 4.7 - setup time for stop condition t su;sto 4.0 - s s data hold time t hd;dat 0 - ns data setup time t su;dat 250 - ns low period of the scl clock t low 4.7 - s high period of the scl clock t high 4.0 - s rise time of both sda and scl signals t f - 1000 ns fall time of both sda and scl signals t r - 300 ns t f t hd;sta t low t r t hd;dat t su;dat t high t su;sta t hd;sta t su;sto t buf sda scl
TCA62724FMG(o,s,el 2010-06-24 11 package dimensions weight: 0.018 g (typ.)
TCA62724FMG(o,s,el 2010-06-24 12 notes on contents 1. block diagrams some of the functional blocks, circuits, or constants in the block diagram may be omitted or simplified for explanatory purposes. 2. equivalent circuits the equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory purposes. 3. timing charts timing charts may be simplified for explanatory purposes. 4. application circuits the application circuits shown in this document are provided for reference purposes only. thorough evaluation is required, especially at the mass production design stage. toshiba does not grant any license to any industrial prop erty rights by providing th ese examples of application circuits. 5. test circuits components in the test circuits are used only to obtai n and confirm the device charac teristics. these components and circuits are not guaranteed to prevent malfunction or failure from occurring in the application equipment. ic usage considerations notes on handling of ics [1] the absolute maximum ratings of a semiconductor device ar e a set of ratings that must not be exceeded, even for a moment. do not exceed any of these ratings. exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result injury by explosion or combustion. [2] use an appropriate power supply fuse to ensure that a large current does not continuously flow in case of over current and/or ic failure. the ic will fully break down when used under conditions that exceed its absolute maximum ratings, when the wiring is routed improperly or when an abnormal pulse noise occurs from the wiring or load, causing a large current to continuously flow and t he breakdown can lead smoke or ignition. to minimize the effects of the flow of a large current in case of breakdow n, appropriate settings, such as fuse capacity, fusing time and insertion circuit location, are required. [3] if your design includes an inductive load such as a motor coil, incorporate a protection circuit into the design to prevent device malfunction or breakdown caused by the current re sulting from the inrush current at power on or the negative current resulting from the back electromotive force at power off. ic breakdown may cause injury, smoke or ignition. use a stable power supply with ics wi th built-in protection functions. if the power supply is unstable, the protection function may not operate, causing ic breakdown. ic breakdown may cause injury, smoke or ignition. [4] do not insert devices in the wrong orientation or incorrectly. make sure that the positive and negative termi nals of power supplies are connected properly. otherwise, the current or power consumption may exceed the absolute maximum rating, and exceeding the rating(s) may cause the device break down, damage or deterioration, and may result injury by explosion or combustion. in addition, do not use any device that is applied the current with inserting in the wrong orientation or incorrectly even just one time. [5] carefully select external components (such as inputs and negative feedback capacitors) and load components (such as speakers), for example, power amp and regulator. if there is a large amount of leakage current such as input or negative feedback condenser, the ic output dc voltage will increase. if this output voltage is connected to a speaker with low input withstand voltage, overcurrent or ic failure can cause smoke or ignition. (the over current can cause smoke or ignition from the ic itself.) in particular, please pay attention when using a bridge ti ed load (btl) connection type ic that inputs output dc voltage to a speaker directly.
TCA62724FMG(o,s,el 2010-06-24 13 points to remember on handling of ics (1) heat radiation design in using an ic with large current flow such as power amp, regulator or driver, please design the device so that heat is appropriately radiated, not to exceed the specified junction temperature (t j ) at any time and condition. these ics generate heat even during normal use. an inadequate ic heat radiation design can lead to decrease in ic life, deterioration of ic characteristics or ic breakdown. in addition, please design the devic e taking into considerate the effect of ic heat radiation with peripheral components. (2) back-emf when a motor rotates in the reverse direction, stops or slows down abruptly, a current flow back to the motor?s power supply due to the effect of back-em f. if the current sink capability of the power supply is small, the device?s motor power supply and output pins might be exposed to conditions beyond maximum ratings. to avoid this problem, take the effect of back-emf into consideration in system design.
TCA62724FMG(o,s,el 2010-06-24 14 about solderability, following conditions were confirmed solderability (1) use of sn-37pb solder bath solder bath temperature: 230 c dipping time: 5 seconds the number of times: once use of r-type flux (2) use of sn-3.0ag-0.5cu solder bath solder bath temperature: 245 c dipping time: 5 seconds the number of times: once use of r-type flux
TCA62724FMG(o,s,el 2010-06-24 15 restrictions on product use ? toshiba corporation, and its subsidiaries and affiliates (colle ctively ?toshiba?), reserve the right to make changes to the in formation in this document, and related hardware, software and systems (collectively ?product?) without notice. ? this document and any information herein may not be reproduced without prior written permission from toshiba. even with toshib a?s written permission, reproduction is permissible only if reproduction is without alteration/omission. ? though toshiba works continually to improve product?s quality and reliability, product can malf unction or fail. customers are responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and systems whic h minimize risk and avoid situations in which a malfunction or failure of prod uct could cause loss of human life, bodily injury or damage to pr operty, including data loss or corruption. before customers use the product, create designs including the pr oduct, or incorporate the product into the ir own applications, customers must also refer to and comply wi th (a) the latest versions of all relev ant toshiba information, including without lim itation, this document, the specifications, the data sheets and application not es for product and the precauti ons and conditions set forth in the ?toshiba semiconductor reliability handbook? and (b) the instructions for the application with which the product will be used with or fo r. customers are solely responsible for all aspects of th eir own product design or applications, inclu ding but not limited to (a) determining th e appropriateness of the use of this product in such design or applications; (b) evaluati ng and determining the applicability of any information contain ed in this document, or in charts, diagrams, programs, algorithms, sample applicati on circuits, or any other referenced documents; and (c) validatin g all operating parameters for such designs and applications. toshiba assumes no liability for customers? product design or applications. ? product is intended for use in general electronics applications (e.g., computers, personal equipment, office equipment, measur ing equipment, industrial robots and home electronics appliances) or for spe cific applications as expressly st ated in this document. product i s neither intended nor warranted for use in equipment or systems that require extraordi narily high levels of quality an d/or reliability and/or a malfu nction or failure of which may cause loss of human life, bodily injury, serious proper ty damage or serious public impact (?unintended use?). uninten ded use includes, without limitation, equipment used in nuclear facilities, equipmen t used in the aerospace industr y, medical equipment, equipmen t used for automobiles, trains, ships and other transportation, traffic si gnaling equipment, equipment used to control combustions or expl osions, safety devices, elevators and escalators, devices re lated to electric power, and equipment used in finance-related fields. do not use product for unintended use unless specifically permitted in this document. ? do not disassemble, analyze, reverse-engineer, alter, modify , translate or copy product, whether in whole or in part. ? product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any applicable laws or regulations. ? the information contained herein is presented only as guidanc e for product use. no responsibility is assumed by toshiba for an y infringement of patents or any other intellectual property rights of third part ies that may result from the use of product. no license to any i ntellectual property right is granted by this document, whether express or implied, by estoppel or otherwise. ? absent a written signed agreement, except as provided in the relevant terms and conditions of sale for product, and to the maximum extent allowable by law, toshiba (1) assumes no liability whatsoever, including without limitation, indirect, consequential, special, or incidental damages or loss, including without limitation, loss of profits, loss of opportunities, busin ess interruption and loss of data, and (2) disclaims any and all express or implied warranties and conditions re lated to sale, use of product, or information, including warranties or conditions of merchantability, fitness for a particular purpose, accuracy of information, or noninfringement. ? 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